Ultra-Compact Automotive cdi/ecu board based on speeduino (atmega2560) with integrated oled1.
Project Overviewi need a professional hardware designer to create an ultra-compact, single-board (smd) automotive ignition ecu based on the open-source speeduino firmware. This board is designed for a single-cylinder motorcycle (Honda CG 150) and will manage ignition only (no fuel injection circuitry required).
Size Constraint (Critical): The PCB must be designed with the absolute minimum footprint possible. The total board area must be no more than 10% larger than the footprint of the standard 1.3" I2c oled display (target pcb dimensions around 37mm x 40mm). To achieve this high-density layout, components must be tightly packed using both sides of the double-sided board (SMD components on the bottom layer, display/LEDs on the top layer).Preferred Software: EasyEDA (Standard or Pro) or KiCad.Manufacturing
Target: jlcpcb smd assembly (components must use standard lcsc library codes).
2. Technical Specifications & Circuit BlocksA. Main Microcontroller (Engine Management):MCU: ATmega2560-16au (tqfp-100 or smaller compatible bga/qfn package if needed for size constraints) running official speeduino firmware.External 16MHz crystal oscillator with ultra-small SMD footprint (e.g., 2016 or 2520 package).B. Power Supply Unit (Automotive Grade):Input: 12VDC from motorcycle battery/stator (needs reverse polarity, overvoltage, and transient protection).Regulator: High-efficiency, ultra-compact automotive low-dropout (LDO) regulator (e.g., LM2940 in SOT-223) to deliver clean 5V without excessive bulk.C. Sensor Inputs & Conditioning:Crankshaft Position (RPM): Must use the Max9926 (qsop-16 / ultra-small smd package) vr conditioner chip to read the stock motorcycle magnetic pickup coil (vr sensor).
Output routes to ATmega Pino D2 (Primary Trigger).MAP Sensor: High-density, micro-SMD absolute pressure sensor (e.g., CFSensor XGZP series or MPXHZ6400A) routed to ATmega Pino
A5.Engine/Oil Temp (clt): ntc thermistor input circuit with a 2.49k Ω 1% bias resistor (0402 or 0603 SMD size) routed to ATmega Pino A2.
Lambda Sensor (O2): Narrowband O2 input (0-1V range) with an ultra-compact RC low-pass filter routed to ATmega Pino A8.
D. Output & Protection Drivers:Ignition Output: Pino D12 (IGN1) will trigger a smart coil-on-plug (Honda Civic 3-pin coil). It needs a compact 1k Ω series resistor and a 5.1V Zener diode for logic
protection.Map Switching ("Fun Button"): Optocoupled input using a micro-SMD PC817 (SOP-4) triggered by a 12V ground switch from the handlebar, routed to ATmega Pino D4 for on-the-fly dual-map selection (Pops & Bangs / Eco modes).
Kill Switch: Optocoupled input using a second PC817 for engine shutdown.E. Display & Data Communication (Dashboard Layout):The 1.3" I2C OLED Display (SH1106/SSD1306) will be mounted directly on the top layer, completely dominating the front surface of the
PCB.To save space while maintaining ignition timing precision, use a secondary micro-SMD processor (such as an ATmega328P in QFN package or an ultra-compact ESP32 module) on the same board acting as a slave dashboard processor. It will read the hardware serial stream from the ATmega2560 TX0 pin to parse and render parameters onto the OLED.Integrate a micro-SMD Bluetooth footprint on the same serial bus for real-time mobile tuning via TunerStudio.3. PCB Layout & Connector RequirementsDimensions: Density-optimized, maximum ~37mm x 40mm (match display footprint + 10% maximum margin).Layer Count: 2 layers (Double-sided PCB).Ground Strategy: Split ground plane is mandatory to isolate noisy power/ignition ground from quiet digital/sensor ground planes.Connector (Critical Upgrade): The board must feature a single, ultra-compact, waterproof, 8-way (8-pin) automotive connector mounted on the bottom or edge of the PCB. The designer is free to choose the most space-efficient, industry-standard 8-pin waterproof surface-mount or through-hole connector (such as TE Connectivity Superseal 1.5 series, Deutsch DT 8-pin miniature, or Molex MX150/MX123) to keep the overall housing profile as small as possible.
Estamos buscando um especialista para desenvolver um layout de Placa de Circuito Impresso (PCB) de alta densidade. O objetivo é criar um design extremamente compacto e profissional, capaz de acomodar o processador Speeduino atrás de uma tela OLED. Para isso, será necessário utilizar componentes smd muito pequenos, como os de tamanhos 0603 ou 0402, e chips nos menores encapsulamentos disponíveis, incluindo qfn ou bga. O projeto visa garantir um produto final com dimensões reduzidas e acabamento de alta qualidade, essencial para se destacar no mercado.
Plazo de Entrega: No definido